Quote for Electronics And Automation Part 8111 by Aim Solder

If you are looking for a great deal on high-quality parts like ONE-STEP Underfill 688; 10 cc; No-Flow Underfill Flip Chip; CSP; BGA; and MICRO-BGA, look no further than Industrials Domain. With an inventory of over 2 billion new and obsolete parts, we are confident that we can help fulfill your requirements while offering unbeatable lead times. This item, listed alongside the part number 8111, was manufactured by Aim Solder and is currently available for immediate purchase. If you are interested in receiving a competitive quotation for 8111, we invite you to use our Instant RFQ service. When completing the RFQ, we ask that you provide as much information as possible, including the quantity needed, price target, and expected delivery date, so that our team may create a personalized solution. With account managers on standby 24/7x365, you will receive a response in 15 minutes or less. 

Part Number:8111
Manufacturer: Aim Solder
Description : ONE-STEP Underfill 688; 10 cc; No-Flow Underfill Flip Chip; CSP; BGA; and MICRO-BGA
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At Industrials Domain, we offer numerous Electronics And Automation parts from leading manufacturers like Aim Solder. Furthermore, as AS9120B, ISO 9001:2015, and FAA AC 00-56B certified and accredited distributor, we stand by the quality of our inventory. In addition, we are the only independent distributor with a No China Sourcing pledge, meaning your order is fully traceable and ships with its qualifying certificates, as applicable. Submit a quote for 8111 - ONE-STEP Underfill 688; 10 cc; No-Flow Underfill Flip Chip; CSP; BGA; and MICRO-BGA today, and see why many customers choose us as their number one distributor. 

Product Attribute of 8111
Color Purple
Physical State Liquid
Series 8100 Series
Setting Time Up to 150 C = 75 seconds, From 150 C to 175 C 30-60 seconds, Peak Temperature 235 C to 250 C 60 seconds
Special Features Flows at 120 C 140 C
Specific Gravity 1.27 g/cc
Temperature Range Maximum at 255 C
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